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NVIDIA GeForce RTX 5070 and RTX 5070 Ti Final Specifications Seemingly Confirmed

Thanks to kopite7kimi, we are able to finalize the leaked specifications of NVIDIA’s upcoming GeForce RTX 5070 and RTX 5070 Ti graphics cards.
Starting off with RTX 5070 Ti, it will feature 8,960 CUDA cores and come equipped with 16 GB GDDR7 memory on a 256-bit memory bus, offering 896 GB/s bandwidth. The card is reportedly designed with a total board power (TBP) of 300 W. The Ti variant appears to use the PG147-SKU60 board design with a GB203-300-A1 GPU. The standard RTX 5070 is positioned as a more power-efficient option, with specifications pointing to 6,144 CUDA cores and 12 GB of GDDR7 memory on a 192-bit bus, with 627 GB/s memory bandwidth. This model is expected to operate at a slightly lower 250 W TBP.

Interestingly, the non-Ti RTX 5070 card will be available in two board variants, PG146 and PG147, both utilizing the GB205-300-A1 GPU. While we don’t know what the pricing structure looks like, we see that NVIDIA has chosen to make more considerable differentiating factors between its SKUs. The Ti variant not only gets an extra four GB of GDDR7 memory, but it also gets a whopping 45% increase in CUDA core count, going from 6,144 to 8,960 cores. While we wait for the CES to see the initial wave of GeForce RTX 50 series cards, the GeForce RTX 5070 and RTX 5070 Ti are expected to arrive later, possibly after RTX 5080 and RTX 5090 GPUs.

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AOC Introduces a Trio of New Gaming Monitors Ahead of CES 2025

Just ahead of CES 2025, prominent display maker AOC has introduced a trio of new gaming monitors. First up, we have the Q25G4S, a 24.5-inch IPS monitor with an impressive 300 Hz refresh rate, ideal for esports titles. The QHD resolution allows for a decent pixel density at its size, making it well-suited for content consumption as well. The monitor boasts dual HDMI 2.1 ports, a DisplayPort 1.4 port, and an audio jack. The monitor appears to be plenty ergonomic as well, with swivel, pivot, tilt and height adjustments courtesy of its included ergonomic stand.

Next up, we have the AOC 27G11ZE3, sporting a 27-inch IPS panel with a slower but impressive 260 Hz refresh rate. The 1080p monitor claims 99% of sRGB color gamut coverage, which is perfectly decent, but the overall content consumption experience will certainly be held back its poor pixel density. The monitor sports a DisplayPort 1.4 input, along with dual HDMI 2.0 inputs. When the latter is used, refresh rate will be limited to 240 Hz. An audio jack is also present.

Last but not the least, we have the highest-end offering among the trio. The AOC AG276QSD sports a 26.5-inch QD-OLED panel with a refresh rate of a whopping 360 Hz. The QHD resolution, along with 99% coverage of the DCI-P3 color gamut allows for an excellent viewing experience on the OLED monitor. Its typical brightness peaks at 250 nits, while the HDR brightness at a 1.5% window peaks at 1000 nits. The monitor boasts dual HDMI 2.1 ports, dual DP 1.4 ports, dual USB-A 3.2 ports, a single USB 3.2 Type-B port as well as an audio jack. The included ergonomic stand boasts height, tilt, and pivot adjustments, which is expected considering its high-end positioning. Interestingly, a pair of 5 W speakers is also present, although there are no guarantees regarding their sound quality, of course.

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Minisforum Launches Portable Monitor With Dual 1080p Displays

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Monday, December 23rd 2024

Portable monitors are undoubtedly a rather niche category of displays, but there sure are people who can greatly benefit from their existence. For such people, the recently announced Minisforum MDSA156 sure does sound like a great product, at least on paper. At a price of $231, the portable monitor is quite affordable too. In fact, the MDSA156 gives buyers not one, but two displays connected with a 315° hinge, with the bottom display having a kick stand built in which allows for multiple setups to fit varying use cases. The product sports dual Type-C ports, as well as an HDMI port for input.

Both the displays sport a 1080p 15.6 inch IPS panel, providing plenty of pixels for all kinds of workloads. Weighing in at just a hair below 1 kg (2.2 lbs), the MDSA156 is commendably portable as well. Minisforum’s website has listed out a variety of setups for the product, which have been attached below. However, with a peak brightness of just 250 nits and a mere 45% coverage of the NTSC color gamut (72% of NTSC ≈ 100% sRGB), the MDSA156 is certainly not meant for any kind of professional usage on the go, at least the kinds that depend on color reproduction. For other workflows, however, the product does look enticing for those who can take advantage of the displays.

Source: Minisforum

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Ryzen AI 9 HX 370-powered GMKTec EVO X1 Mini PC Goes on Sale

AMD’s recently announced Strix Point APU lineup has received favorable reviews from critics and consumers alike. Especially for SFF/Mini PC enthusiasts, Strix Point brings commendable efficiency and performance to the table – both of which are absolutely essential for a high-end mini PC. The GMK EVO-X1 is surely among those, and the system is now available for purchase from GMKTec’s official online store.

The EVO X1 sports a 110.19 x 107.3 x 63.2 mm chassis, which is decently compact for its class. As mentioned previously, the system is powered by the 12-core (4x Zen 5 + 8x Zen 5c) Ryzen AI 9 HX 370 APU with the shockingly potent RDNA 3.5-based Radeon 890M iGPU with 16 CUs. For most CPU-centric workloads, the EVO X1 should easily suffice. The iGPU, as mentioned, is potent enough to handle most graphically demanding tasks, including some lightweight gaming, but expecting anything more from it would be futile. Thankfully, an OCuLink port is present, which should allow for extremely fast eGPU connections courtesy of its 64 Gbps bandwidth.

The system comes with 32 GB of LPDDR5X-7500 memory, which unfortunately, is not user-upgradeable. Storage requirements, on the other hand, are taken care of by dual M.2 2280 slots which are user-accessible, of course, and can accommodate up to a maximum of 8 TB. Connectivity is decent, with the system featuring a healthy spread of USB 3.2 Gen 2 ports, USB4, HDMI, DP 2.1, and an audio jack. The absence of Ethernet is certainly a major bummer, though. But at least, the system does look well-equipped from nearly every other angle. As for pricing, the EVO X1 is currently available for $949.99 for the 32 GB + 1 TB variant. Expensive? Sure, but that’s just what we have come to expect from Strix Point.

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ASUS Teases Next-generation RTX 50-powered Gaming Laptops For CES 2025

Last week, we reported on a massive leak that gave us a glimpse at a surfeit of upcoming ROG gaming laptops from ASUS boasting Arrow Lake-HX and Strix Halo processors, along with RTX 50-series Laptop GPUs. The company has now gone ahead and officially teased its ROG Flow Z13 laptop and the ROG Strix 18 laptop, the videos for which were obtained by VideoCardz. Considering that these were just teasers, the details shared were sparse, but undoubtedly intriguing regardless.

The ROG Strix 18, will likely boast the Core Ultra 9 285HX and Core Ultra 9 275HX CPUs along with NVIDIA “Blackwell” Laptop GPUs, with up to an 175-watt RTX 5090 Laptop with 16 GB of GDDR7 VRAM. Multiple other GPU options will also be available, with the RTX 5070 Ti Laptop GPU being the entry-point as per the leaked listings. Clearly, the Strix 18 is poised to be a powerful and power-hungry desktop replacement-class laptop, along with a massive 18-inch mini LED screen with a speedy 240 Hz refresh rate. Needless to say, the G18 has no intention of being affordable.

Next up, we have the ROG Flow Z13, which has also appeared in previous leaks which we have reported on. As expected from a “Flow” product, the laptop will likely feature a detachable keyboard and a compact chassis, at least by powerful gaming laptop standards. At its core, the Flow Z13 will be powered by AMD’s upcoming Strix Halo APUs, which will feature a Zen 5 “only” setup with extremely powerful integrated graphics with as many as 40 CUs, making the system powerful enough to not require discrete graphics at all. ASUS has stated that the laptops will drop between January 5-6th, 2025, which means we won’t have much waiting to do to see what ASUS has in store for us.

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Upcoming Lenovo Legion Go Handhelds Teased to Launch on January 7 Along With Surprise Valve Walk-on

It is no surprise that Lenovo is cooking up the next-generation of Legion Go consoles for launch next month. We have reported on a plethora of leaks surrounding both the affordable Legion Go S, and the Legion Go 2 handheld gaming consoles. Finally, it appears that there is some concrete information regarding their launch – Lenovo, in an email to The Verge, has confirmed new Legion handhelds are dropping next month. But that’s not all – according to The Verge, the launch event will have a surprise guest.

Our readers who have been keeping tabs on the Legion Go 2 rumor cycle will recall that we recently reported on a leaked image of the upcoming Legion Go S which had an interesting detail – the handheld features a dedicated button for Steam. Now, of course, we’re completely in the dark regarding what that button’s presence entails. It is entirely possible that the button is simply for opening the Steam app, or, it could indicate that the Legion Go 2 might run SteamOS – we simply don’t know yet.

However, as revealed by The Verge, the invitation for the launch event includes a rather special guest. SteamOS and Steam Deck co-designer, Pierre-Loup Griffais, will be attending the event along with several other AMD, Microsoft, and Valve employees. Unfortunately for us, though, no other details were shared. That said, considering the information at hand, a surprise partnership of sorts between Lenovo and Valve is undoubtedly far from inconceivable.

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OneXPlayer G1 Gaming Laptop Unveiled With Compact Enclosure and Strix Point Firepower

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Friday, December 20th 2024

OneXPlayer has pulled back the veil on its G1 gaming notebook, and the product sure does look intriguing. Calling it a notebook might not even be fair, considering that its 8.8-inch display barely exceeds tablet territory. However, for lovers of compact gaming systems and handhelds, the G1 looks like it ticks many boxes, and its detachable keyboard is undoubtedly a welcome addition.

The system is powered by AMD’s 12-core Ryzen AI 9 HX 370 “Strix Point” APU with 4 Zen 5 and 8 Zen 5c cores, along with a powerful Radeon 890M iGPU with 16 CUs based on the RDNA 3.5 architecture. The aforementioned 8.8-inch display is quite the looker as well, featuring a 2.5K resolution with a speedy 144 Hz refresh rate. At least on paper, it appears that the OneXPlayer G1 leaves very little room for complaint.

Should the Radeon 890M iGPU not suffice, the OneXPlayer G1 also sports OCuLink support, which will come in handy when involving eGPUs, offering much higher bandwidth as compared to USB4. At 900 grams, the 8.8-inch device is certainly on the moderately heavy side for its size, but at least the controls look decent, and there is an option for a detachable keyboard as well. OneXPlayer has not revealed any other information regarding the product, nor is there any word on pricing or availability. But considering the specifications, the G1 gaming notebook will most probably command a pretty buck.

Source: Videocardz

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XDefiant Signs Off With Assassin’s Creed-Flavored Bang, Delivers 13 New Maps and Plenty of New Content in Final Patch

Ubisoft announced earlier this month that it would be sunsetting its free-to-play first-person shooter, XDefiant, on June 3, 2025, after dwindling player counts made it unfeasible to continue supporting the live-service game. Despite the game being shut down by Ubisoft, the game’s development team at Ubisoft San Francisco apparently still wanted to follow through with some of the content it had in the game’s pipeline. In an announcement on X, the game’s executive producer clarifies that much of the content that is being delivered in what he calls the last patch contains all the content that was planned for Season 3 along with some content from future seasons of the game, including Season 4, 5, 6, 7, and 8.

Some major highlights in the new patch, are 13 new maps, three new factions, including the Assassins—from Assassin’s Creed—six new weapons, and five new game modes. Along with the slew of new content, XDefiant received a handful of gameplay and QoL fixes for both competitive and casual play. The new maps consist of eight new arena maps, four new linear maps, and one new tactical map. XDefiant also got a new progression system that allows players to unlock cosmetics, badges, and other rewards for character progression. The developer also introduced daily rewards and “Credits,” the game’s new in-game currency that allows players to buy skins and other items from previous seasons.

Overall, the response to these new updates has been quite positive, with many fans asking one of two questions: “Why didn’t Ubisoft release this earlier?” And “Why did Ubisoft cancel the game without giving these updates a chance first?” Although dropping all of this content all at once is a much more transformative move than the Season 3 update was meant to be, even the Season 3 content looks like it could have made a difference to the game as a whole. A group of fans has even started a Change.org petition to bring XDefiant back from the dead. While it’s a valiant effort to save a game they love, it seems unlikely that Ubisoft would go back on its decision, regardless of signatures.

Read Mark Rubin’s statement about the final XDefiant content update:

Hello Everyone,

So here it is! Our last content patch for XDefiant. It’s obviously a bittersweet moment but I just want to say how proud I am of everyone on this team that did everything they could to make this game and all of its amazing content.

Ubisoft has not only allowed a small team to stay on and continue working to get our Season 3 content out the door, but we’ve also been able to add some extra content to this release from future seasons. So, we have our Season 3 content plus some of the content from Season 4, 5, 6,7 and even Season 8.

We are adding 3 new factions this patch with the Assassin’s of course that was planned for Season 3 but also Wolves and Omega Force from Seasons 4 and 5 respectively.

We are also adding 6 new Arena Maps and 3 new Linear Maps from future seasons. So along with the 4 new maps from Season 3 that’s a total of 13 new maps. And I have to say the team really went all out on these amazing new maps. If you do anything at all, you need to check out the new Rayman map that was going to be part of an epic event takeover in Season 4. It even has it’s own mode with Lum Hunt.

We’ve added a brand-new experience called Tactical that is all about corridor style maps with the first mode in that experience called Defuse; a 1-life classic Bomb mode.

We’ve added the ability to play against Bots in a way that would have allowed players to warm up or just chill out with less pressure but still gaining XP.

There are a few new weapons that were supposed to come in future seasons as well. Along with new cosmetics that have all been unlocked for everyone. There is new progression mechanics with Faction Mastery and Badges that the community would have to come together to discover how they all can be earned.

All of this and more are our last tribute to all of the hard-working people that made this game and to all of the fans who have been with us through this journey. Not all journeys end well but we can all be proud of what we accomplished.

I wish everyone who worked on this game directly or indirectly the best for their future endeavors. And the same goes for all of the fans who played our game, who streamed it, or who worked to build the XDefiant community.

Thank you all!
Mark

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ASUS ROG Flow Z13 Leaks Out With AMD Ryzen AI Max “Strix Halo” APUs and 180 Hz Display

Just recently, we covered a juicy new leak regarding the Geekbench performance of the upcoming Ryzen AI Max+ 395 “Strix Halo” APU. It is no secret that AMD plans on launching the Strix Halo lineup at CES 2025, which happens to be less than a month away. Unsurprisingly, leaked listings of upcoming laptops and other products have been steadily popping up on the internet, with the ASUS ROG Flow Z13 being the rumor mill’s latest victim.

As revealed by the product listings by retailers, the ASUS ROG Flow Z13 will indeed pack some truly impressive specifications. Needless to say, the product will feature a variant with the highest-end Ryzen AI Max+ 395 APU with 16 cores and 32 threads, along with an RDNA 3.5-based iGPU with 40 CUs, likely named the Radeon 8060S, which is expected to match mid-range discrete graphics in performance. A slightly lower-tier variant is also listed, with a 12-core Ryzen AI Max 390 APU.

The system will also boast 32 GB of LPDDR5X memory, along with 1 TB of solid-state storage. There is no doubt that more variants with different memory and storage configurations will be available, but those have seemingly not been listed yet. Interestingly, the Flow Z13 will come with a 13.4-inch 180 Hz display with 2.5 K resolution, which is a modest step-up from its predecessor. However, it will be an IPS panel, which might be massively disappointing for OLED enthusiasts. There is no word on pricing, but with CES 2025 less than a month away, we won’t have to wait too long to find out. That said, it is safe to assume that a price hike is likely, if the recent “Strix Point” launch is anything to go by.

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(PR) APECS Chiplet Pilot Line Starts Operation in the Framework of the EU Chips Act

The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semiconductor manufacturing capabilities and chiplet innovation as part of the EU Chips Act. By providing large industry players, SMEs, and start-ups with a facilitated access to cutting-edge technology, the APECS pilot line will establish a strong foundation for resilient and robust European semiconductor supply chains. Within APECS, the institutes collaborating in the Research Fab Microelectronics Germany (FMD) will work closely with European partners, to make a significant contribution to the European Union’s goals of increasing technological resilience, strengthening cross-border collaboration and enhancing its global competitiveness in semiconductor technologies. APECS is co-funded by the Chips Joint Undertaking and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the “Chips for Europe” initiative. The overall funding for APECS amounts to €730 million over 4.5 years.

Europe is home to a vibrant ecosystem of (hidden) champions, from traditional enterprises in vertical markets, to SMEs and start-ups the competitive advantages of which lie in superior semiconductor-based solutions. Nevertheless, many of these companies are currently confronted with limited access to advanced semiconductor technologies, while at the same time these technologies are increasingly becoming the most important factor for innovation and market growth.

The European Commission is investing significant resources under the EU Chips Act to strengthen semiconductor technologies and applications in the European Union. This aims to enhance Europe’s technological resilience, secure supply and value chains, and drive innovation in emerging fields such as energy efficient AI, manufacturing, mobility, information and communications, neuromorphic and quantum computing as well as trusted and sustainable electronics.

The APECS pilot line focuses on bridging application-oriented research with innovative developments in heterogeneous integration, in particular emerging chiplet technologies. By pushing beyond conventional system-in-package (SiP) methods, APECS will deliver robust and trusted heterogeneous systems, significantly boosting the innovation capacity of the European semiconductor industry.

Innovation where European industries need it the most
The APECS pilot line will play a key role in supporting European microelectronics by developing new system integration technologies and unlocking new functionalities within the system-technology co-optimization (STCO) approach. This will enable European companies to develop advanced products, even in low quantities, at competitive costs. By providing a wide range of technologies on a single platform, APECS is positioned to become Europe’s leading hub for the development of advanced packaging and heterogeneous integration.

APECS will be a key driver of collaboration among European RTOs, industry and academia, fostering a lively innovation ecosystem. Customers will benefit from a single point of contact to the APECS pilot line. APECS will cover end-to-end design and pilot production capabilities and accelerate progress from cutting-edge research to practical, scalable manufacturing solutions.

Furthermore, APECS will play a pivotal role in Europe’s transition towards a carbon-neutral and circular economy through its promotion on eco-design and green manufacturing initiatives.

Boosting Innovation through strong multilevel Collaboration
The APECS pilot line builds on the structures established by the Research Fab Microelectronics Germany (FMD). In Germany, twelve institutes from the Fraunhofer Group for Microelectronics and the two Leibniz institutes FBH and IHP participate in APECS. The work is led by the central office in Berlin.

Prof. Albert Heuberger, spokesman of the Fraunhofer Group for Microelectronics and chairman of the FMD, emphasizes: “The success of the EU Chips Act relies on strong partnerships. For years, the FMD has successfully combined the strengths of decentralized research institutions with the collaborative potential of a centralized microelectronics hub. This clearly illustrates how APECS is set to become a long-term accessible pilot line for all European stakeholders across the entire value chain. Together with the other EU Chips Act pilot lines, APECS will be a crucial component for heterogeneous integration and advanced packaging of the envisioned pan-European pilot line facility – and thus an indispensable instrument of EU Chips Act.”

The APECS consortium brings together the technological competences, infrastructure, and know-how of ten partners from eight European countries: Germany (Fraunhofer-Gesellschaft as coordinator, FBH, IHP), Austria (TU Graz), Finland (VTT), Belgium (imec), France (CEA-Leti), Greece (FORTH), Spain (IMB-CNM, CSIC) and Portugal (INL). APECS is coordinated by the Fraunhofer-Gesellschaft and implemented by the Research Fab Microelectronics Germany (FMD).

Fraunhofer IPMS plays a pivotal role
Fraunhofer IPMS plays a pivotal role in the APECS pilot line and is set to advance the project’s objectives in chiplet design and integration technology. One part covers the chiplet system design, where we will setup advanced system architectures for computing, artificial intelligence and MEMS sensors/actuators. The second large part covers innovative chiplet (Back-end-of-line) integration technologies, including 3D stacking and 2.5D wafer-level integration, functional interposers with ultra-high density, and the use of CMOS and MEMS/non-silicon chiplets. One main part of our contribution is the development of quasi monolithic integration (QMI), which will set new benchmarks in chiplet integration technology.

Investments in strategic projects such as APECS under the EU Chips Act, is crucial for positioning Europe as an indispensable partner in the global technology sector. Germany plays a key role in this endeavor – both as a leading research hub and a driving economic force. Thanks to substantial funding from the German Federal Ministry of Education and Research (BMBF) and the federal states of Saxony, Berlin, Bavaria, Schleswig-Holstein, Baden-Württemberg, North Rhine-Westphalia, Brandenburg, and Saxony-Anhalt, it will be possible to further expand the R&D infrastructure in the coming years within the framework of the APECS pilot line. This represents a crucial step toward ensuring the long-term economic stability of both Germany and Europe.

“Fraunhofer plays a central role in the implementation of major projects such as APECS, which strengthen Germany’s technological resilience and capacity for innovation,” emphasizes Prof. Holger Hanselka, President of the Fraunhofer-Gesellschaft. “With our practice-oriented research and close collaboration with industry, academia, and political partners, we lay the foundation not only for developing cutting-edge technologies but also for bringing them into industrial application. APECS is an example how to connect research with business – it underscores how close cooperation with ministries and other partners can secure Europe’s position in the global microelectronics market.”