Category: News

Ubisoft announced earlier this month that it would be sunsetting its free-to-play first-person shooter, XDefiant, on June 3, 2025, after dwindling player counts made it unfeasible to continue supporting the live-service game. Despite the game being shut down by Ubisoft, the game’s development team at Ubisoft San Francisco apparently still wanted to follow through with some of the content it had in the game’s pipeline. In an announcement on X, the game’s executive producer clarifies that much of the content that is being delivered in what he calls the last patch contains all the content that was planned for Season 3 along with some content from future seasons of the game, including Season 4, 5, 6, 7, and 8.

Some major highlights in the new patch, are 13 new maps, three new factions, including the Assassins—from Assassin’s Creed—six new weapons, and five new game modes. Along with the slew of new content, XDefiant received a handful of gameplay and QoL fixes for both competitive and casual play. The new maps consist of eight new arena maps, four new linear maps, and one new tactical map. XDefiant also got a new progression system that allows players to unlock cosmetics, badges, and other rewards for character progression. The developer also introduced daily rewards and “Credits,” the game’s new in-game currency that allows players to buy skins and other items from previous seasons.

Overall, the response to these new updates has been quite positive, with many fans asking one of two questions: “Why didn’t Ubisoft release this earlier?” And “Why did Ubisoft cancel the game without giving these updates a chance first?” Although dropping all of this content all at once is a much more transformative move than the Season 3 update was meant to be, even the Season 3 content looks like it could have made a difference to the game as a whole. A group of fans has even started a Change.org petition to bring XDefiant back from the dead. While it’s a valiant effort to save a game they love, it seems unlikely that Ubisoft would go back on its decision, regardless of signatures.

Read Mark Rubin’s statement about the final XDefiant content update:

Hello Everyone,

So here it is! Our last content patch for XDefiant. It’s obviously a bittersweet moment but I just want to say how proud I am of everyone on this team that did everything they could to make this game and all of its amazing content.

Ubisoft has not only allowed a small team to stay on and continue working to get our Season 3 content out the door, but we’ve also been able to add some extra content to this release from future seasons. So, we have our Season 3 content plus some of the content from Season 4, 5, 6,7 and even Season 8.

We are adding 3 new factions this patch with the Assassin’s of course that was planned for Season 3 but also Wolves and Omega Force from Seasons 4 and 5 respectively.

We are also adding 6 new Arena Maps and 3 new Linear Maps from future seasons. So along with the 4 new maps from Season 3 that’s a total of 13 new maps. And I have to say the team really went all out on these amazing new maps. If you do anything at all, you need to check out the new Rayman map that was going to be part of an epic event takeover in Season 4. It even has it’s own mode with Lum Hunt.

We’ve added a brand-new experience called Tactical that is all about corridor style maps with the first mode in that experience called Defuse; a 1-life classic Bomb mode.

We’ve added the ability to play against Bots in a way that would have allowed players to warm up or just chill out with less pressure but still gaining XP.

There are a few new weapons that were supposed to come in future seasons as well. Along with new cosmetics that have all been unlocked for everyone. There is new progression mechanics with Faction Mastery and Badges that the community would have to come together to discover how they all can be earned.

All of this and more are our last tribute to all of the hard-working people that made this game and to all of the fans who have been with us through this journey. Not all journeys end well but we can all be proud of what we accomplished.

I wish everyone who worked on this game directly or indirectly the best for their future endeavors. And the same goes for all of the fans who played our game, who streamed it, or who worked to build the XDefiant community.

Thank you all!
Mark

Just recently, we covered a juicy new leak regarding the Geekbench performance of the upcoming Ryzen AI Max+ 395 “Strix Halo” APU. It is no secret that AMD plans on launching the Strix Halo lineup at CES 2025, which happens to be less than a month away. Unsurprisingly, leaked listings of upcoming laptops and other products have been steadily popping up on the internet, with the ASUS ROG Flow Z13 being the rumor mill’s latest victim.

As revealed by the product listings by retailers, the ASUS ROG Flow Z13 will indeed pack some truly impressive specifications. Needless to say, the product will feature a variant with the highest-end Ryzen AI Max+ 395 APU with 16 cores and 32 threads, along with an RDNA 3.5-based iGPU with 40 CUs, likely named the Radeon 8060S, which is expected to match mid-range discrete graphics in performance. A slightly lower-tier variant is also listed, with a 12-core Ryzen AI Max 390 APU.

The system will also boast 32 GB of LPDDR5X memory, along with 1 TB of solid-state storage. There is no doubt that more variants with different memory and storage configurations will be available, but those have seemingly not been listed yet. Interestingly, the Flow Z13 will come with a 13.4-inch 180 Hz display with 2.5 K resolution, which is a modest step-up from its predecessor. However, it will be an IPS panel, which might be massively disappointing for OLED enthusiasts. There is no word on pricing, but with CES 2025 less than a month away, we won’t have to wait too long to find out. That said, it is safe to assume that a price hike is likely, if the recent “Strix Point” launch is anything to go by.

The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semiconductor manufacturing capabilities and chiplet innovation as part of the EU Chips Act. By providing large industry players, SMEs, and start-ups with a facilitated access to cutting-edge technology, the APECS pilot line will establish a strong foundation for resilient and robust European semiconductor supply chains. Within APECS, the institutes collaborating in the Research Fab Microelectronics Germany (FMD) will work closely with European partners, to make a significant contribution to the European Union’s goals of increasing technological resilience, strengthening cross-border collaboration and enhancing its global competitiveness in semiconductor technologies. APECS is co-funded by the Chips Joint Undertaking and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the “Chips for Europe” initiative. The overall funding for APECS amounts to €730 million over 4.5 years.

Europe is home to a vibrant ecosystem of (hidden) champions, from traditional enterprises in vertical markets, to SMEs and start-ups the competitive advantages of which lie in superior semiconductor-based solutions. Nevertheless, many of these companies are currently confronted with limited access to advanced semiconductor technologies, while at the same time these technologies are increasingly becoming the most important factor for innovation and market growth.

The European Commission is investing significant resources under the EU Chips Act to strengthen semiconductor technologies and applications in the European Union. This aims to enhance Europe’s technological resilience, secure supply and value chains, and drive innovation in emerging fields such as energy efficient AI, manufacturing, mobility, information and communications, neuromorphic and quantum computing as well as trusted and sustainable electronics.

The APECS pilot line focuses on bridging application-oriented research with innovative developments in heterogeneous integration, in particular emerging chiplet technologies. By pushing beyond conventional system-in-package (SiP) methods, APECS will deliver robust and trusted heterogeneous systems, significantly boosting the innovation capacity of the European semiconductor industry.

Innovation where European industries need it the most
The APECS pilot line will play a key role in supporting European microelectronics by developing new system integration technologies and unlocking new functionalities within the system-technology co-optimization (STCO) approach. This will enable European companies to develop advanced products, even in low quantities, at competitive costs. By providing a wide range of technologies on a single platform, APECS is positioned to become Europe’s leading hub for the development of advanced packaging and heterogeneous integration.

APECS will be a key driver of collaboration among European RTOs, industry and academia, fostering a lively innovation ecosystem. Customers will benefit from a single point of contact to the APECS pilot line. APECS will cover end-to-end design and pilot production capabilities and accelerate progress from cutting-edge research to practical, scalable manufacturing solutions.

Furthermore, APECS will play a pivotal role in Europe’s transition towards a carbon-neutral and circular economy through its promotion on eco-design and green manufacturing initiatives.

Boosting Innovation through strong multilevel Collaboration
The APECS pilot line builds on the structures established by the Research Fab Microelectronics Germany (FMD). In Germany, twelve institutes from the Fraunhofer Group for Microelectronics and the two Leibniz institutes FBH and IHP participate in APECS. The work is led by the central office in Berlin.

Prof. Albert Heuberger, spokesman of the Fraunhofer Group for Microelectronics and chairman of the FMD, emphasizes: “The success of the EU Chips Act relies on strong partnerships. For years, the FMD has successfully combined the strengths of decentralized research institutions with the collaborative potential of a centralized microelectronics hub. This clearly illustrates how APECS is set to become a long-term accessible pilot line for all European stakeholders across the entire value chain. Together with the other EU Chips Act pilot lines, APECS will be a crucial component for heterogeneous integration and advanced packaging of the envisioned pan-European pilot line facility – and thus an indispensable instrument of EU Chips Act.”

The APECS consortium brings together the technological competences, infrastructure, and know-how of ten partners from eight European countries: Germany (Fraunhofer-Gesellschaft as coordinator, FBH, IHP), Austria (TU Graz), Finland (VTT), Belgium (imec), France (CEA-Leti), Greece (FORTH), Spain (IMB-CNM, CSIC) and Portugal (INL). APECS is coordinated by the Fraunhofer-Gesellschaft and implemented by the Research Fab Microelectronics Germany (FMD).

Fraunhofer IPMS plays a pivotal role
Fraunhofer IPMS plays a pivotal role in the APECS pilot line and is set to advance the project’s objectives in chiplet design and integration technology. One part covers the chiplet system design, where we will setup advanced system architectures for computing, artificial intelligence and MEMS sensors/actuators. The second large part covers innovative chiplet (Back-end-of-line) integration technologies, including 3D stacking and 2.5D wafer-level integration, functional interposers with ultra-high density, and the use of CMOS and MEMS/non-silicon chiplets. One main part of our contribution is the development of quasi monolithic integration (QMI), which will set new benchmarks in chiplet integration technology.

Investments in strategic projects such as APECS under the EU Chips Act, is crucial for positioning Europe as an indispensable partner in the global technology sector. Germany plays a key role in this endeavor – both as a leading research hub and a driving economic force. Thanks to substantial funding from the German Federal Ministry of Education and Research (BMBF) and the federal states of Saxony, Berlin, Bavaria, Schleswig-Holstein, Baden-Württemberg, North Rhine-Westphalia, Brandenburg, and Saxony-Anhalt, it will be possible to further expand the R&D infrastructure in the coming years within the framework of the APECS pilot line. This represents a crucial step toward ensuring the long-term economic stability of both Germany and Europe.

“Fraunhofer plays a central role in the implementation of major projects such as APECS, which strengthen Germany’s technological resilience and capacity for innovation,” emphasizes Prof. Holger Hanselka, President of the Fraunhofer-Gesellschaft. “With our practice-oriented research and close collaboration with industry, academia, and political partners, we lay the foundation not only for developing cutting-edge technologies but also for bringing them into industrial application. APECS is an example how to connect research with business – it underscores how close cooperation with ministries and other partners can secure Europe’s position in the global microelectronics market.”

It looks like the end of the console-exclusive era is marching ever forward. On the one hand, more game studios are embracing simultaneous launch strategies, as was recently emphasized by both Square Enix and Ubisoft adopting multi-platform simultaneous launches for Fantasian Neo Dimension and Assassin’s Creed Shadows, respectively. The latest game to join this trend is Outer Worlds 2, which will launch on all platforms—Xbox Series S|X, Windows, PlayStation 5, and even Game Pass—simultaneously in late 2025. The surprising bit about the multi-platform launch of The Outer Worlds 2 is that Microsoft purchased Obsidian Entertainment, the studio behind The Outer Worlds, leading many to believe that future games in the franchise would be Xbox/Windows-first. While the original Outer Worlds was released after Microsoft bought Obsidian, the launch contract predates the acquisition, so it also had a simultaneous launch, regardless of Microsoft’s ownership.

In addition to the swathe of new games embracing multiple simultaneous platform launches, Jez Cordon, executive editor at Windows Central and well-regarded source for gaming rumors, recently also sparked rumors with a post on X suggesting that no future games developed by Microsoft or its subsidiary studios will be permanent console exclusives. In a reply to a comment criticizing Microsoft for seemingly keeping some games on Xbox and others not, Cordon said “They don’t. They’re all coming to PlayStation over time.”

Cordon also goes on later in the discussion to suggest that the only reason Microsoft hasn’t forced its smaller subsidiary studios to pivot to the day-one cross-platform launch strategy is because of development load and those studios not being well-equipped to deal with a simultaneous launch. This is something that Square Enix veteran, Naoki Yoshida, also alluded to when he was talking about Square Enix’s shift to the simultaneous launch strategy.

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‘, }); }); } loadjs.ready([‘jquery’, ‘fancybox’, ‘swiper’], function() { attachLightbox(‘a[data-fancybox]’); if ($(window).width()<600) { $(‘.imgcontainer’).each(function() { var $this=$(this); if (($this.find(‘a’).length==1) || ($this.find(‘a’).length>7)) return; $this.addClass(‘swiper-container’); $this.find(‘a’).addClass(‘swiper-slide’).css(‘width’, ‘auto’).wrapAll(”); $this.find(‘.swiper-wrapper’).after(”); new Swiper ($this.eq(0), { slidesPerView: ‘auto’, slidesPerGroup: 1, spaceBetween: 15, pagination: { el: ‘.swiper-pagination’, clickable: true } }); }); } $(‘.newspost’).on(‘click’, ‘.spoiler > .button, .spoiler > a’, function(e) { e.preventDefault(); $(this).next(‘div’).toggle(); }); $(‘.newspost’).on(‘click’, ‘.ispoiler’, function(e) { e.preventDefault(); $(this).find(‘div’).css(‘filter’, ”); $(this).removeClass(‘ispoiler’); }); $(‘.contnt’).on(‘click’, ‘.newspoll_btn’, function() { popup.Show(‘TechPowerUp Quick Poll’,’Loading…’); $.get(‘/news-poll/options?id=’+$(this).data(‘id’), function(data) { $(‘#popup_content’).html(data); }); }); }); ]]>

On the morning of the launch of Warframe 1999, the ambitious 90s-themed update and story expansion for sci-fi-fantasy looter-shooter Warframe, Digital Extremes published the update notes for Warframe 1999, which launched in the morning of December 13. Warframe 1999 introduces a new tile-set, called Höllvania, alongside its companion cinematic quest, which will send players back in time to discover the Protoframes and help find the Protoframe creator, Albrecht Entrati. Players will form part of an underground resistance team alongside the Protoframes, although players will not play as the Protoframes or even their own Warframes in 1999. Instead, players will travel to Höllvania and complete the new Hex quest as Drifter. Höllvania has its own seasons, and players will enter the new area in winter.

The update also adds new quests and mission types in the new map, which see players hunt down and stop the Techrot and Scaldra in a number of classic Warframe game modes, including assassination, exterminate, and Warframe’s first PvPvE mode. Along with the new game modes, there is also a new Warframe—appropriately called Cyte-09, sticking with the 90s theme—who looks to be something of an all-rounder, thanks to his abilities. Cyte-09 also drops with his own signature rifle, the Reconifex, which applies a heat effect and reload speed buff on timed reloads, and the Vesper77 secondary, which appears to be a critical-based sidearm that highlights weak points when aiming down the sights. There are also a number of changes coming to Warframe’s core gameplay, including the introduction of the Atomicycle motorcycle, which will be available for all open maps, and the long-awaited Nyx and Trinity reworks. Find out more about the more minor changes in the full Warframe 1999 patch notes.

Cyte-09’s Abilities:

Passive
Each Weak Point Kill permanently increases Cye-09’s Weak Point Critical Chance by 1% up to 300%.

Ability 1: Seek
Plant an antenna that projects a forward wave scan. Detected enemies take increased Weak Point Damage, and become visible through walls. Weapons gain Punchthrough.

Ability 2: Resupply
Throw two Elemental Ammo Packs that instantly refill the active weapon’s magazine, while granting the weapon an additional instance of the selected Elemental Damage and Status Effect. Reload clears the effect. Sniper Rifles gain extra damage.
Hold the ability to select the Elemental Damage type.
Resupply is Cyte-09’s Railjack Tactical ability.

Ability 3: Evade
Jump backwards and become invisible for a short duration. Killing enemies extends the duration and heals Cyte-09.
Evada is Cyte-09’s subsummable Helminth ability. It is altered to have a capped maximum duration of 25 seconds.

Ability 4: Neutralize
Summon the Neutralizer, Cyte-09’s exalted Sniper Rifle. Bullets ricochet off Weak Points to seek out other nearby Weak Points. Alt fire lobs a Cold grenade that completely freezes enemies.

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‘, }); }); } loadjs.ready([‘jquery’, ‘fancybox’, ‘swiper’], function() { attachLightbox(‘a[data-fancybox]’); if ($(window).width()<600) { $(‘.imgcontainer’).each(function() { var $this=$(this); if (($this.find(‘a’).length==1) || ($this.find(‘a’).length>7)) return; $this.addClass(‘swiper-container’); $this.find(‘a’).addClass(‘swiper-slide’).css(‘width’, ‘auto’).wrapAll(”); $this.find(‘.swiper-wrapper’).after(”); new Swiper ($this.eq(0), { slidesPerView: ‘auto’, slidesPerGroup: 1, spaceBetween: 15, pagination: { el: ‘.swiper-pagination’, clickable: true } }); }); } $(‘.newspost’).on(‘click’, ‘.spoiler > .button, .spoiler > a’, function(e) { e.preventDefault(); $(this).next(‘div’).toggle(); }); $(‘.newspost’).on(‘click’, ‘.ispoiler’, function(e) { e.preventDefault(); $(this).find(‘div’).css(‘filter’, ”); $(this).removeClass(‘ispoiler’); }); $(‘.contnt’).on(‘click’, ‘.newspoll_btn’, function() { popup.Show(‘TechPowerUp Quick Poll’,’Loading…’); $.get(‘/news-poll/options?id=’+$(this).data(‘id’), function(data) { $(‘#popup_content’).html(data); }); }); }); ]]>

Friday, December 13th 2024

CoolIT Systems (CoolIT), the world’s leader in liquid cooling systems for advanced computing, is continuing to invest in its manufacturing capabilities to support the surging demand for liquid cooling of AI systems. Along with a 25x capacity expansion in a new Calgary, Canada manufacturing facility, CoolIT recently hired Scott Hudson as Vice President of Quality to lead the company’s development of world-class quality operations and systems.

“As the leader in direct liquid cooling for over two decades, our customers expect leading performance and reliability from CoolIT products,” said CoolIT’s COO Patrick McGinn. ” Adding Scott as CoolIT’s VP of Quality reinforces CoolIT’s commitment to developing best-in-class quality standards for liquid cooling products.” Scott joins CoolIT from Celestica, where he led the company’s global quality strategy for all business segments across over 30 sites. His career spans three decades of quality leadership roles in the worldwide computer hardware industry, overseeing multi-site operations in North America, Asia and Europe.

“Ensuring the culture of quality permeates all aspects of our business and our relationships with suppliers, customers, and technology partners is central to my mission, as well as CoolIT’s continued leadership in liquid cooling,” emphasized Scott.

CoolIT’s end-to-end direct liquid cooling products are essential to operating current and future generations of AI data centers. The company’s investments in manufacturing support the rapid build-out of production capacity to support the world’s top AI cloud service providers and leading semiconductor and server manufacturers.

We recently reported on the overwhelmingly negative response from the Dauntless community after the game’s latest Awakening update and Steam launch. Now, Jessie Leigh Gagnon, a former Phoenix Labs developer and the former associate producer for Dauntless, has also weighed in on the current state of the game and the changes introduced by the indie developer. According to Gagnon’s post on LinkedIn, the creative team that birthed Dauntless and maintained it before Phoenix Labs’s dark times “never would have made decisions that are so blatantly not player focused.” She seemingly attributes the disastrous Steam launch and poor decision-making that led to the maligned update to the studio’s new ownership.

According to Gagnon’s description, when Dauntless was first launched, Phoenix Labs was an indie studio in the true sense. It was a group of passionate developers who simply wanted to create something fun. In this case a Monster Hunter-like game that wasn’t locked to the Nintendo DS and didn’t force its players to deal with “aching hands, cumbersome inventory management, and a lore that wasn’t super approachable.” Since then, though, Phoenix Labs has been through the wringer and lost much of its original creative talent and many of its former executives, supposedly all culminating in a game that seems to have put monetization before all else.

Gagnon goes on to plead with Phoenix Labs to correct course and focus on what made the ARPG what it is, stating that the “core gameplay and crafting mechanics” had been “gutted” in the recent update.

Dauntless today is no longer Free to Slay. They’ve gutted the core gameplay and crafting mechanics. The essence of the Slayers (who I named just over ten years ago), has been, in fact, slayed to ribbons. We never would have made decisions that are so blatantly not player focused.

I have the privilege of working in academia now, where I can be open and honest about my opinions on other games – and this is the time for me to speak up and say DO BETTER WITH DAUNTLESS. Please, if not for us creators, FOR THE PLAYERS.

Phoenix Labs was owned by a Singaporean company, Garena, between 2020 and 2023, when it was announced that an “investor-backed buyout” would place the game studio in the hands of its management team. It was never really revealed who the investors backing the management team were, but what followed was a massive round of layoffs and a management exodus, which included the then CEO and COO. As recently as October 2024, however, Game Developer received a tip that the mysterious buyout was funded by Forte Labs, a blockchain company. After the layoffs that followed the buyout, Dauntless went through a content drought, and two former Phoenix Labs employees who spoke to Game Developer revealed that Neil Young, the interim CEO who was in charge after the Forte take-over, “didn’t share the creative values” of Phoenix Labs.

Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today announced that it has pioneered a new custom HBM compute architecture that enables XPUs to achieve greater compute and memory density. The new technology is available to all of its custom silicon customers to improve the performance, efficiency and TCO of their custom XPUs. Marvell is collaborating with its cloud customers and leading HBM manufacturers, Micron, Samsung Electronics, and SK hynix to define and develop custom HBM solutions for next-generation XPUs.

HBM is a critical component integrated within the XPU using advanced 2.5D packaging technology and high-speed industry-standard interfaces. However, the scaling of XPUs is limited by the current standard interface-based architecture. The new Marvell custom HBM compute architecture introduces tailored interfaces to optimize performance, power, die size, and cost for specific XPU designs. This approach considers the compute silicon, HBM stacks, and packaging. By customizing the HBM memory subsystem, including the stack itself, Marvell is advancing customization in cloud data center infrastructure. Marvell is collaborating with major HBM makers to implement this new architecture and meet cloud data center operators’ needs.

The Marvell custom HBM compute architecture enhances XPUs by serializing and speeding up the I/O interfaces between its internal AI compute accelerator silicon dies and the HBM base dies. This results in greater performance and up to 70% lower interface power compared to standard HBM interfaces. The optimized interfaces also reduce the required silicon real estate in each die, allowing HBM support logic to be integrated onto the base die. These real-estate savings, up to 25%, can be used to enhance compute capabilities, add new features, and support up to 33% more HBM stacks, increasing memory capacity per XPU. These improvements boost XPU performance and power efficiency while lowering TCO for cloud operators.

“The leading cloud data center operators have scaled with custom infrastructure. Enhancing XPUs by tailoring HBM for specific performance, power, and total cost of ownership is the latest step in a new paradigm in the way AI accelerators are designed and delivered,” said Will Chu, Senior Vice President and General Manager of the Custom, Compute and Storage Group at Marvell. “We’re very grateful to work with leading memory designers to accelerate this revolution and, help cloud data center operators continue to scale their XPUs and infrastructure for the AI era.”

“Increased memory capacity and bandwidth will help cloud operators efficiently scale their infrastructure for the AI era,” said Raj Narasimhan, senior vice president and general manager of Micron’s Compute and Networking Business Unit. “Strategic collaborations focused on power efficiency, such as the one we have with Marvell, will build on Micron’s industry-leading HBM power specs, and provide hyperscalers with a robust platform to deliver the capabilities and optimal performance required to scale AI.”

“Optimizing HBM for specific XPUs and software environments will greatly improve the performance of cloud operators’ infrastructure and ensure efficient power use,” said Harry Yoon, corporate executive vice president of Samsung Electronics and head of Americas products and solutions planning. “The advancement of AI depends on such focused efforts. We look forward to collaborating with Marvell, a leader in custom compute silicon innovation.”

“By collaborating with Marvell, we can help our customers produce a more optimized solution for their workloads and infrastructure,” said Sunny Kang, VP of DRAM Technology, SK hynix America. “As one of the leading pioneers of HBM, we look forward to shaping this next evolutionary stage for the technology.”

“Custom XPUs deliver superior performance and performance per watt compared to merchant, general-purpose solutions for specific, cloud-unique workloads,” said Patrick Moorhead, CEO and Founder of Moor Insights & Strategy. “Marvell, already a player in custom compute silicon, is already delivering tailored solutions to leading cloud companies. Their latest custom compute HBM architecture platform provides an additional lever to enhance the TCO for custom silicon. Through strategic collaboration with leading memory makers, Marvell is poised to empower cloud operators in scaling their XPUs and accelerated infrastructure, thereby paving the way for them to enable the future of AI.”

Marvell and the M logo are trademarks of Marvell or its affiliates. Please visit www.marvell.com for a complete list of Marvell trademarks. Other names and brands may be claimed as the property of others.

This press release contains forward-looking statements within the meaning of the federal securities laws that involve risks and uncertainties. Forward-looking statements include, without limitation, any statement that may predict, forecast, indicate or imply future events, results or achievements. Actual events, results or achievements may differ materially from those contemplated in this press release. Forward-looking statements are only predictions and are subject to risks, uncertainties and assumptions that are difficult to predict, including those described in the “Risk Factors” section of our Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q and other documents filed by us from time to time with the SEC. Forward-looking statements speak only as of the date they are made. Readers are cautioned not to put undue reliance on forward-looking statements, and no person assumes any obligation to update or revise any such forward-looking statements, whether as a result of new information, future events or otherwise.

GameMax, an emerging brand of PC gaming components including gaming cases and power supply units, proudly announces the GS SFX Gold Series power supply units featuring ATX 3.1 and PCIe 5.1 standards. The GameMax GS SFX Gold Series features native 12V-2×6 connectors for the latest NVIDIA RTX graphics cards. The GS SFX Gold Series is available in 650 W, 750 W, and 850 W models—all of which are available in black and white colors to color-match your PC build!

The circuit design features advanced Active PFC, Half-Bridge LLC Resonance, Synchronous Rectification, and DC-DC topology to ensure high performance and efficiency particularly to the +12V rail for graphics cards. The GS SFX Gold Series PSU’s FMD-F161E131B microcontroller intelligently manages the fan with a stop/start function, enabling the fan to stop below 20% load for silent 0 dBA operation.

High Efficiency
The GS SFX Gold Series PSUs achieves 80 Plus Gold certification, offering a conversion efficiency exceeding 90%, ensuring energy savings and optimal performance.
High-Quality and Durable Japanese Capacitors
The GS SFX Gold Series comes equipped with high-quality 105°C Japanese main capacitors that provides stable and reliable power.

HDB Quiet Fan
Uses low-noise Hydraulic Bearing (HDB) fan designed for longevity achieving a lifespan of up to 40,000 hours and resistance to high temperatures.

Clean and Aesthetic
Available in black and white, builders can color-match the GS SFX Gold to their PC build. Its fully modular design minimizes cable use, the 12V-2×6 cable comes with a 90° angled connector that simplifies cable management.

Full Protection
Comprehensive protection features includes OVP, UVP, OPP, OCP, SCP, OTP, and SIP to safeguard the system. The GS SFX Gold Series also meets multiple certifications, including CB, TÜV, CE, and FCC.

Pricing, Warranty and Availability
The GameMax GS SFX Gold Series is available in 650 W, 750 W, and 850 W models, all covered with a 5-year warranty. See pricing below.

• GS-650G SFX Gold: $114.29 (black), $116.29 (white)
• GS-750G SFX Gold: $127.69 (black), $129.69 (white)
• GS-850G SFX Gold: $140.99 (black), $142.99 (white)

For more information, visit the product page.